Display device and method of fabricating display device

ABSTRACT

A display device may include a display panel and an input sensor thereon. The input sensor may include an active region and a pad region adjacent to each other and may include a sensing electrode overlapped with the active region to sense an input, a sensing pad overlapped with the pad region, and a sensing line electrically connecting the sensing electrode to the sensing pad. The sensing pad may include a pad portion and an edge portion, which is extended from the pad portion to an edge of the input sensor in a plan view. Each of the pad portion and the edge portion may include a first pad and a second pad, which is at least partially overlapped with the first pad. In the edge portion, at least a portion of the second pad may be spaced apart from the first pad, in a plan view.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.17/187,114, filed on Feb. 26, 2021, which claims priority to and thebenefit of Korean Patent Application No. 10-2020-0061651, filed on May22, 2020 in the Korean Intellectual Property Office, the entire contentsof both of which are hereby incorporated by reference.

BACKGROUND 1. Field

Aspects of embodiments of the present disclosure relate to a displaydevice and a method of fabricating a display device.

2. Description of the Related Art

Various display apparatuses are being developed for use in multimediadevices, such as televisions, mobile phones, tablet computers,navigation systems, gaming machines, and the like. A keyboard or a mousemay be used as an input device of the display device. In certain cases,an input sensor, such as a touch panel, is also used as the input deviceof the display device.

A variety of failures may occur in a process of fabricating a displaydevice or in a display device fabricated by the process. Such a failuremay occur in the input sensor.

SUMMARY

According to an aspect of embodiments of the inventive concept, adisplay device including an input sensor and a fabricating methodthereof are provided.

According to another aspect of embodiments of the inventive concept, adisplay device, in which a failure rate is low, is provided.

According to another aspect of embodiments of the inventive concept, ina method of fabricating a display device, a failure may be prevented orsubstantially prevented from occurring when a display device isfabricated.

According to one or more embodiments of the inventive concept, a displaydevice includes a display panel and an input sensor on the displaypanel. The input sensor may include an active region and a pad regionadjacent to the active region. The input sensor may include a sensingelectrode overlapped with the active region and configured to sense aninput, a sensing pad overlapped with the pad region, and a sensing lineelectrically connecting the sensing electrode to the sensing pad. Thesensing pad may include a pad portion and an edge portion, which isextended from the pad portion to an edge of the input sensor when viewedin a plan view. Each of the pad portion and the edge portion may includea first pad and a second pad, which is at least partially overlappedwith the first pad. At least a portion of the second pad of the edgeportion may be spaced apart from and may not be overlapped with thefirst pad of the edge portion, when viewed in a plan view.

In an embodiment, the edge portion may include a first portion, which isin a first region adjacent to the pad portion, and a second portion,which is in a second region extended from the first region to the edgeof the input sensor. An end of the second portion may be aligned to theedge of the input sensor in a thickness direction of the input sensor.

In an embodiment, the first portion of the edge portion may include thefirst pad, a first insulating layer on the first pad, the second pad onthe first insulating layer, and a second insulating layer on the secondpad.

In an embodiment, the second insulating layer may cover all of the firstpad, the first insulating layer, and the second pad.

In an embodiment, an end of the first insulating layer and an end of thefirst pad may be aligned to each other in a thickness direction of thedisplay panel.

In an embodiment, the second portion may substantially include only thesecond pad, at least a portion of which is on the display panel and isexposed to an outside.

In an embodiment, the pad portion may further include a first insulatinglayer on the first pad and a second insulating layer on the second pad.A first contact hole may be defined in the first insulating layer toelectrically connect the first pad to the second pad.

In an embodiment, a second contact hole may be defined in the secondinsulating layer to expose the second pad to an outside.

In an embodiment, the display panel may include a first base substrate,a second base substrate opposite to the first base substrate, a circuitdevice layer between the first base substrate and the second basesubstrate, and a light-emitting device layer on the circuit devicelayer.

In an embodiment, the first pad may be in contact with a top surface ofthe second base substrate.

In an embodiment, the second pad of the edge portion may include aplurality of second pads.

In an embodiment, the second pad of the pad portion may be overlappedwith the first pad, and the second pad of the edge portion may not beoverlapped with the first pad.

In an embodiment, the first pad may include a metallic material, and thesecond pad may include a transparent conductive oxide (TCO) material.

According to one or more embodiments of the inventive concept, a methodof fabricating a display device may include: providing a display panel,in which a display region, a pad region, and a cutting region aredefined; arranging an input sensor including a sensing pad, on thedisplay panel; and cutting the display panel and the input sensor alongthe cutting region. The pad and cutting regions may be adjacent to thedisplay region. The arranging the input sensor may include arranging afirst pad, which is at least overlapped with the pad region and thecutting region, on the display panel, arranging a second pad on thefirst pad, and removing a portion of the first pad overlapped with thecutting region. The arranging the second pad may be performed such thatthe second pad is not overlapped with the first pad in the cuttingregion.

In an embodiment, the method may further include arranging an insulatinglayer, which is not overlapped with the cutting region and covers thefirst pad and the second pad. The arranging the insulating layer may beperformed between the removing the portion of the first pad overlappedwith the cutting region and the cutting the display panel along thecutting region.

In an embodiment, the removing of the portion of the first padoverlapped with the cutting region may include etching a portion of thefirst pad overlapped with the cutting region.

In an embodiment, the arranging the input sensor may further includearranging a first insulating layer on the first pad and arranging asecond pad on the first insulating layer.

In an embodiment, the first insulating layer may not be overlapped withthe cutting region, and the insulating layer may cover a portion of thefirst pad, which is different from the portion to be removed, when aportion of the first pad overlapped with the cutting region is etched.

In an embodiment, the input sensor may include a pad portion and an edgeportion, which are overlapped with the pad region, and the edge portionmay be adjacent to the cutting region.

In an embodiment, the arranging the second pad may be performed suchthat, in the edge portion, at least a portion of the second pad is notoverlapped with the first pad.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be more clearly understood from the following briefdescription of some example embodiments, taken in conjunction with theaccompanying drawings. The accompanying drawings represent non-limiting,example embodiments as described herein.

FIG. 1A is a perspective view illustrating a display device according toan embodiment of the inventive concept.

FIG. 1B is an exploded perspective view illustrating the display deviceof FIG. 1A.

FIGS. 1C and 1D are cross-sectional views taken along the line A-A′ ofFIG. 1B.

FIG. 2A is a cross-sectional view illustrating a display substrateaccording to an embodiment of the inventive concept.

FIG. 2B is a plan view illustrating a display substrate according to anembodiment of the inventive concept.

FIG. 3 is a plan view illustrating an input sensor according to anembodiment of the inventive concept.

FIG. 4A is a plan view illustrating a region AR1 of FIG. 3.

FIG. 4B is a cross-sectional view taken along the line X-X′ of FIG. 4A.

FIG. 5A is a plan view illustrating a region AR2 of FIG. 3.

FIG. 5B is a cross-sectional view taken along the line Y-Y′ of FIG. 5A.

FIG. 6 is a plan view illustrating a region AR3 of FIG. 3.

FIG. 7A is a cross-sectional view taken along the line I-I′ of FIG. 6.

FIG. 7B is a cross-sectional view taken along the line II-II′ of FIG. 6.

FIG. 7C is a cross-sectional view taken along the line III-III′ of FIG.6.

FIG. 7D is a cross-sectional view taken along the line IV-IV′ of FIG. 6.

FIG. 7E is a cross-sectional view taken along the line V-V′ of FIG. 6.

FIGS. 8A to 8D are plan views illustrating a method of fabricating adisplay device, according to an embodiment of the inventive concept.

FIG. 9 is a plan view illustrating a method of fabricating a displaydevice, according to an embodiment of the inventive concept.

FIG. 10 is a plan view illustrating a method of fabricating a displaydevice, according to an embodiment of the inventive concept.

FIGS. 11A and 11B are plan views, each of which illustrates a pad regionof a display device according to an embodiment of the inventive concept.

The figures are intended to illustrate the general characteristics ofmethods, structures, and/or materials utilized in certain exampleembodiments and to supplement the written description provided below.The drawings may not, however, be to scale and may not precisely reflectthe structural or performance characteristics of any given embodiment,and should not be interpreted as limiting the range of values orproperties encompassed by the example embodiments. For example, therelative thicknesses and positioning of components, layers, regions,and/or structural elements may be reduced or exaggerated for clarity.The use of similar or same reference numbers in the various drawings isintended to indicate the presence of a similar or same element orfeature.

DETAILED DESCRIPTION

Embodiments of the inventive concepts will now be described more fullywith reference to the accompanying drawings, in which some exampleembodiments are shown. Embodiments of the inventive concepts may,however, be embodied in many different forms and should not be construedas being limited to the example embodiments set forth herein; rather,these example embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the concept of embodimentsto those of ordinary skill in the art. In the drawings, the thicknessesof layers and regions may be exaggerated for clarity. Like referencenumerals in the drawings denote like elements, and, thus, their repeateddescription may be omitted.

It is to be understood that when an element is referred to as being“connected” or “coupled” to another element, it may be directlyconnected or coupled to the other element or one or more interveningelements may be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present. Like numbers indicate likeelements throughout. As used herein the term “and/or” includes any andall combinations of one or more of the associated listed items. Otherterms used to describe the relationship between elements or layersshould be interpreted in a like fashion (e.g., “between” versus“directly between,” “adjacent” versus “directly adjacent,” and “on”versus “directly on”).

It is to be understood that, although the terms “first,” “second,” etc.may be used herein to describe various elements, components, regions,layers, and/or sections, these elements, components, regions, layers,and/or sections should not be limited by these terms. These terms areused to distinguish one element, component, region, layer, or sectionfrom another element, component, region, layer, or section. Thus, afirst element, component, region, layer, or section discussed belowcould be termed a second element, component, region, layer, or sectionwithout departing from the teachings of example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It is to be understood thatthe spatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, for example, the term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting of example embodiments.As used herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It is to be further understood that the terms “comprises,”“comprising,” “includes,” and/or “including,” if used herein, specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Some example embodiments of the inventive concepts are described hereinwith reference to cross-sectional illustrations that may be schematicillustrations of idealized embodiments (and intermediate structures) ofexample embodiments. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments of theinventive concepts should not be construed as limited to the particularshapes of regions illustrated herein, but are to include deviations inshapes that result, for example, from manufacturing.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which embodiments of the inventiveconcepts belong. It is to be further understood that terms, such asthose defined in commonly-used dictionaries, should be interpreted ashaving a meaning that is consistent with their meaning in the context ofthe relevant art and are not to be interpreted in an idealized or overlyformal sense unless expressly so defined herein.

FIG. 1A is a perspective view illustrating a display device EA accordingto an embodiment of the inventive concept; FIG. 1B is an explodedperspective view of the display device EA of FIG. 1A; and FIGS. 1C and1D are cross-sectional views taken along the line A-A′ of FIG. 1B.Herein, the display device EA according to the present embodiment willbe described in further detail with reference to FIGS. 1A to 1D.

The display device EA may be activated by an electrical signal. Thedisplay device EA may be realized in any of various forms. For example,the display device EA may include one of tablets, laptop computers,computers, smart televisions, and so forth. In the present embodiment,the display device EA may be a smartphone, as illustrated in FIGS. 1Aand 1B.

The display device EA may include a display surface FS, which is used todisplay an image IM. The display surface FS may be parallel to a surfacedefined by a first direction DR1 and a second direction DR2. A directionnormal to the display surface FS (e.g., a thickness direction of thedisplay device EA) will be referred to as a third direction DR3. Herein,the third direction DR3 may be used to differentiate a front or topsurface of each element from a back or bottom surface. Herein, the firstto third directions DR1, DR2, and DR3 may be directions indicated byfirst to third direction axes, respectively, and will be identified withthe same reference numbers.

The display surface FS, on which the image IM is displayed, maycorrespond to a front surface of the display device EA and a frontsurface FS of a window member 100. Herein, the display or front surfaceof the display device EA and the front surface of the window member 100will be identified using the same reference number. As shown FIG. 1A, aclock icon and a plurality of application icons may be displayed as anexample of the image IM.

The display device EA may include the window member 100 and anelectronic panel 200. In an embodiment, although not shown, the displaydevice EA may further include an optical member disposed between thewindow member 100 and the electronic panel 200. In an embodiment, theoptical member may include a polarizer. In an embodiment, the opticalmember may include a color filter member reducing reflectance of anexternal light.

The window member 100 may include a base panel. For example, the basepanel may be formed of at least one of glass, plastic, or a combinationthereof. The front surface FS of the window member 100 may include atransmission region TA and a bezel region BZA. The transmission regionTA may be an optically transparent region. For example, the transmissionregion TA may be a region, of which transmittance to a visible light isabout 90% or higher.

The bezel region BZA may have relatively low optical transmittance,compared with the transmission region TA. The bezel region BZA maydefine a shape of the transmission region TA. In an embodiment, thebezel region BZA may be provided adjacent to the transmission region TAto enclose the transmission region TA. In an embodiment, the windowmember 100 may further include a light-blocking pattern, which isdisposed on the base panel to define the bezel region BZA.

In an embodiment, the bezel region BZA may have a color (e.g., apredetermined color). The bezel region BZA may cover a peripheral regionNAA of the electronic panel 200 and thus may prevent or substantiallyprevent the peripheral region NAA from being recognized by a user.However, the inventive concept is not limited to this example, and, inan embodiment, at least a portion of the bezel region BZA may be omittedfrom the window member 100.

The electronic panel 200 may be configured to display the image IM andto sense an external input TC. The image IM may be displayed on thefront surface FS of the electronic panel 200. The front surface FS ofthe electronic panel 200 may include an active region AA and theperipheral region NAA. The active region AA may be a region that isactivated by an electrical signal. The active region AA may be a regionoverlapped with pixels PX, which will be described with reference toFIG. 2B.

In the present embodiment, the active region AA may be used to displaythe image IM and to sense the external input TC. The active region AAmay correspond to the transmission region TA, and the peripheral regionNAA may correspond to the bezel region BZA. In the presentspecification, an expression “a region or portion corresponds to anotherregion or portion” means that the two regions or portions are overlappedwith each other, but, even in this case, they may not necessarily havethe same area and/or the same shape.

In an embodiment, the electronic panel 200 may include a display panel210, an input sensor 220, a driving circuit DIC, and a flexible circuitboard CF. In an embodiment, a pair of the flexible circuit boards CF maybe provided in the electronic panel 200, as shown in FIG. 1B.

The display panel 210 may produce substantially the image IM. Thedisplay panel 210 may be a light-emitting display panel. In anembodiment, the light-emitting display panel may be one of an organiclight-emitting display panel, a quantum dot light-emitting displaypanel, and a micro LED light-emitting display panel. The panels may beclassified according to a material to be used for a light emittinglayer. A light emitting layer of the organic light-emitting displaypanel may include an organic luminescent material. A light emittinglayer of the quantum dot light-emitting display panel may includequantum dots and/or quantum rods. A light emitting layer of the microLED light-emitting display panel may include a plurality of micro LEDs.Herein, the organic light-emitting display panel will be described as anexample of the display panel 210.

The input sensor 220 may sense an external input (e.g., a touch event)applied from the outside. In the present embodiment, the input sensor220 may be a capacitive-type touch sensor, but the inventive concept isnot limited to this example.

The driving circuit DIC may be disposed on the display panel 210. Thedriving circuit DIC may be mounted on the display panel 210. The drivingcircuit DIC may be electrically connected to the display panel 210 toprovide electrical signals, which are used to operate the display panel210, to the display panel 210.

The flexible circuit board CF may be electrically connected to the inputsensor 220. In an embodiment, a sensing driving circuit may be mountedon the flexible circuit board CF. The flexible circuit board CF mayelectrically connect the input sensor 220 to the display panel 210 or toanother flexible circuit board.

Referring to FIG. 1C, in an embodiment, the display panel 210 mayinclude a display substrate 210-B, an encapsulation substrate 210-U, anda sealing element SM attaching the display substrate 210-B to theencapsulation substrate 210-U. The display substrate 210-B may includethe pixels PX (see FIG. 2B) substantially producing the image. In anembodiment, the encapsulation substrate 210-U may hermetically seal thepixels PX to prevent or substantially prevent the pixels PX from beingdamaged by external moisture or the like.

The driving circuit DIC may be mounted on the display substrate 210-B.In an embodiment, the driving circuit DIC may be provided in the form ofan integrated chip. However, the inventive concept is not limited tothis example, and, in an embodiment, the driving circuit DIC may not bemounted on the display substrate 210-B.

In an embodiment, each of the display substrate 210-B and theencapsulation substrate 210-U may include a glass substrate serving as abase substrate thereof. In an embodiment, the display substrate 210-Bmay have an area larger than the encapsulation substrate 210-U. Thedriving circuit DIC may be disposed on an exposed region of the displaysubstrate 210-B, which is not covered by the encapsulation substrate210-U. However, the inventive concept is not limited to this example,and, in an embodiment, the display substrate 210-B and the encapsulationsubstrate 210-U may have substantially the same shape. An outer or topsurface of the encapsulation substrate 210-U may serve as a basesurface, on which the input sensor 220 is disposed.

The sealing element SM may include, for example, a frit. The frit is aceramic adhesive material, which can be melted and solidified through alaser exposure process. In an embodiment, the frit may include 15-40 wt% V₂O₅, 10-30 wt % TeO₂, 1-15 wt % P₂O₅, 1-15 wt % BaO, 1-20 wt % ZnO,5-30 wt % ZrO₂, 5-20 wt % WO₃, and 1-15 wt % BaO, which are used as aprincipal ingredient, and at least one of Fe₂O₃, CuO, MnO, Al₂O₃, Na₂O,or Nb₂O₅, which are used as an additive agent. If the frit is preparedto have the above composition, the frit may have a thermal expansioncoefficient of 40-100×10⁻⁷/° C. and a glass transition temperature of250° C.—400° C.

The sealing element SM may be overlapped with the peripheral region NAA.

Referring to FIG. 1D, in an embodiment, the display panel 210 mayinclude the display substrate 210-B and a thin encapsulation layer210-L. In an embodiment, the thin encapsulation layer 210-L mayhermetically seal a display device layer 210-OLED (see FIG. 2A). In anembodiment, the thin encapsulation layer 210-L may include at least oneinorganic layer. In an embodiment, the thin encapsulation layer 210-Lmay include a plurality of inorganic layers and a plurality of organiclayers. In an embodiment, the thin encapsulation layer 210-L may have astructure in which an inorganic layer, an organic layer, and aninorganic layer are stacked. The topmost layer of the thin encapsulationlayer 210-L may serve as a base surface, on which the input sensor 220is disposed. Herein, the technical features of the display panel 210will be described based on the display panel 210 of FIG. 1C.

FIG. 2A is a cross-sectional view illustrating the display substrate210-B according to an embodiment of the inventive concept; and FIG. 2Bis a plan view illustrating the display substrate 210-B according to anembodiment of the inventive concept. Herein, the display substrate 210-Baccording to an embodiment of the inventive concept will be describedwith reference to FIGS. 2A and 2B.

As shown in FIG. 2A, the display substrate 210-B may include a basesubstrate 210-G (herein, a first base substrate), a circuit device layer210-CL disposed on a top or inner surface of the first base substrate210-G, and a display device layer 210-OLED disposed on the circuitdevice layer 210-CL. The display substrate 210-B may further include aninsulating layer covering the display device layer 210-OLED.

In an embodiment, the first base substrate 210-G may include a glasssubstrate, a metal substrate, or a substrate made of anorganic/inorganic composite material. The circuit device layer 210-CLmay include at least one insulating layer and a circuit device. Theinsulating layer may include at least one inorganic layer and at leastone organic layer. The circuit device may include sensing lines, a pixeldriving circuit, or the like. The display device layer 210-OLED mayinclude at least organic light emitting diodes serving as its emissionelements. The display device layer 210-OLED may further include anorganic layer, such as a pixel definition layer.

As shown in FIG. 2B, the display substrate 210-B may include a drivingcircuit GDC, a plurality of sensing lines SGL, and a plurality of pixelsPX.

The driving circuit GDC may include a scan driving circuit. The scandriving circuit may generate a plurality of scan signals andsequentially output the scan signals to a plurality of scan lines GL,which will be described below. In addition, the scan driving circuit mayoutput other control signals to a driving circuit of the pixel PX.

The scan driving circuit may include a plurality of transistors, whichmay be formed by the same method as that for the driving circuit of thepixels PX or, for example, by a low-temperature polycrystalline silicon(LTPS) process and/or a low-temperature polycrystalline oxide (LTPO)process.

The sensing lines SGL may include the scan lines GL, data lines DL, apower line PL, and a control signal line CSL. Each of the scan lines GLmay be connected to corresponding ones of the pixels PX, and each of thedata lines DL may be connected to corresponding ones of the pixels PX.The power line PL may be connected to the pixels PX. The control signalline CSL may be used to provide control signals to the scan drivingcircuit.

As shown in FIG. 2B, the display substrate 210-B may include a mountingregion DDA, in which the driving circuit DIC (see FIG. 1C) is disposed.The driving circuit DIC may be connected to the data lines DL.

FIG. 3 is a plan view of the input sensor 220 according to an embodimentof the inventive concept. The input sensor 220 may be disposed on thedisplay panel 210 (see FIG. 1B). The input sensor 220 may include aplurality of sensing electrodes SE1 and SE2 and a plurality of sensinglines SL1, SL2, and SL3, which are connected to the sensing electrodesSE1 and SE2. The sensing electrodes SE1 and SE2 may be disposed in theactive region AA. The sensing electrodes SE1 and SE2 may include aplurality of first sensing electrodes SE1 and a plurality of secondsensing electrodes SE2, which are provided to cross each other. Thefirst sensing electrodes SE1 may be extended in the first direction DR1and may be arranged in the second direction DR2. Each of the firstsensing electrodes SE1 may include a plurality of first sensing portionsSP1 and a plurality of first intermediate portions BP1, which arearranged in the first direction DR1.

The second sensing electrodes SE2 may be extended in the seconddirection DR2 and may be arranged in the first direction DR1. Each ofthe second sensing electrodes SE2 may include a plurality of secondsensing portions SP2 and a plurality of second intermediate portionsBP2, which are arranged in the second direction DR2.

The sensing lines SL1, SL2, and SL3 may be disposed in the peripheralregion NAA. The sensing lines SL1, SL2, and SL3 may include a pluralityof first sensing lines SL1, a plurality of second sensing lines SL2, anda plurality of third sensing lines SL3.

The first sensing lines SL1 may be connected to ends of the firstsensing electrodes SE1, respectively. The second sensing lines SL2 maybe connected to ends of the second sensing electrodes SE2, respectively.The third sensing lines SL3 may be connected to opposite ends of thesecond sensing electrodes SE2, respectively. However, the inventiveconcept is not limited to this connection structure of the sensingelectrodes SE1 and SE2 and the sensing lines SL1, SL2, and SL3.

Pad regions PDA1, PDA2, and PDA3 may be defined in the input sensor 220.The input sensor 220 may include sensing pads disposed in the padregions PDA1, PDA2, and PDA3. In an embodiment, the pad region mayinclude a first pad region PDA1, a second pad region PDA2, and a thirdpad region PDA3. The sensing pads, which are respectively disposed inthe first to third pad regions PDA1, PDA2, and PDA3, may be connected tothe first, second, and third sensing lines SL1, SL2, and SL3,respectively.

FIG. 4A is a plan view illustrating a region AR1 of FIG. 3; and FIG. 4Bis a cross-sectional view taken along the line X-X′ of FIG. 4A. Herein,the input sensor 220 will be described in further detail with referenceto FIGS. 4A and 4B, along with FIG. 3.

As shown in FIGS. 4A and 4B, the region AR1 may correspond to anintersection region of the first and second sensing electrodes SE1 andSE2. The first and second intermediate portions BP1 and BP2 may bedisposed in the intersection region. In the present embodiment, thefirst sensing portion SP1 and the first intermediate portion BP1 may beprovided as a single object, whereas the second sensing portion SP2 andthe second intermediate portion BP2 may be provided as separatedobjects, but the inventive concept is not limited to this example. Forexample, in an embodiment, the first sensing portion SP1 and the firstintermediate portion BP1 may be provided as separated objects, whereasthe second sensing portion SP2 and the second intermediate portion BP2may be provided as a single object.

In the case in which the sensing portion and the intermediate portionare not provided as a single object, they may be defined as an electrodepattern and a bridge pattern, respectively. For example, in the presentembodiment, the second sensing electrode SE2 may include an electrodepattern SP2 and a bridge patterns BP2. Although two bridge patternsBP2-1 and BP2-2 are illustrated, as an example, to be disposed on oneintersection region, the number of the bridge patterns is not limited toa specific number.

In the present embodiment, the bridge pattern BP2 may include a firstportion B1, a second portion B2, and a third portion B3. The secondportion B2 may be disposed on a layer different from that of the firstportion B1 and the third portion B3. The second portion B2 may bedisposed on the same layer as that of the electrode patterns SP2.

As shown in FIGS. 4A and 4B, the input sensor 220 may be directlydisposed on an outer or top surface of the encapsulation substrate210-U. In the present embodiment, the encapsulation substrate 210-U isillustrated, as an example, to include only a base substrate (herein, asecond base substrate), but the inventive concept is not limited to thisexample. In the present embodiment, a portion of the bridge pattern BP2is illustrated to be in contact with the top surface of theencapsulation substrate 210-U, but the inventive concept is not limitedto this example.

In an embodiment, a buffer layer may be further disposed on the topsurface of the encapsulation substrate 210-U, and a portion of thebridge pattern BP2 may be in contact with a top surface of the bufferlayer. The buffer layer may include at least one of an inorganic layeror an organic layer.

In an embodiment, the input sensor 220 may not be directly disposed onthe encapsulation substrate 210-U, and, here, an adhesive layer may bedisposed between the input sensor 220 and the encapsulation substrate210-U. A base layer of the input sensor 220 may be attached to theencapsulation substrate 210-U through the adhesive layer.

According to the present embodiment, at least a portion of the bridgepattern BP2 may be in contact with the top surface of the encapsulationsubstrate 210-U. The first portion B1 and the third portion B3 may bedisposed on the top surface of the encapsulation substrate 210-U. In anembodiment, the first portion B1 and the third portion B3 may be formedof or include a metallic material. For example, the first portion B1 andthe third portion B3 may be formed of or include at least one oftitanium (Ti), aluminum (Al), copper (Cu), gold (Au), or silver (Ag). Inan embodiment, the first portion B1 and the third portion B3 may be amulti-layered structure including a metal layer made of the metallicmaterial.

A first insulating layer 221 may be disposed on the top surface of theencapsulation substrate 210-U. The first sensing electrode SE1, theelectrode patterns SP2, and the second portion B2 may be disposed on thefirst insulating layer 221. An opening BP1-OP may be defined in thefirst intermediate portion BP1, and the second portion B2 may beprovided in the opening BP1-OP. The electrode patterns SP2 and thesecond portion B2 may be connected to the bridge pattern BP2 through apenetration hole 221-TH penetrating the first insulating layer 221.

In an embodiment, the first sensing electrode SE1, the electrodepatterns SP2, and the second portion B2 may be formed of or include asame material. For example, the first sensing electrode SE1, theelectrode patterns SP2, and the second portion B2 may be formed of orinclude at least one of transparent conductive oxide (TCO) materials. Inan embodiment, the first sensing electrode SE1, the electrode patternsSP2, and the second portion B2 may be formed of or include at least oneof indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), orindium tin zinc oxide (ITZO), and, in an embodiment, may be formed of orinclude PEDOT, metal nano wires, or graphene.

A second insulating layer 222 may be disposed on the first insulatinglayer 221. The second insulating layer 222 may cover the first sensingelectrode SE1, the electrode patterns SP2, and the second portion B2.Each of the first and second insulating layers 221 and 222 may be formedof or include at least one of inorganic and/or organic materials. Eachof the first and second insulating layers 221 and 222 may have a single-or multi-layered structure.

In an embodiment, the bridge pattern BP2 may include only a metalpattern disposed on the top surface of the encapsulation substrate210-U. The bridge pattern

BP2 may not cross the first intermediate portion BP1. The bridge patternBP2 may be overlapped with the first sensing portions SP1 to take a longpath around the first intermediate portion BP1. Here, the second portionB2 may be disposed within the first sensing portion SP1.

FIG. 5A is a plan view illustrating a region AR2 of FIG. 3; and FIG. 5Bis a cross-sectional view taken along the line Y-Y′ of FIG. 5A. FIG. 6is a plan view illustrating a region AR3 of FIG. 3. Herein, the inputsensor 220 will be described in further detail with reference to FIGS.5A, 5B, and 6, along with FIGS. 3, 4A, and 4B.

Referring to FIGS. 5A, 5B, and 6, the sensing lines SL1, SL2, and SL3may be connected to sensing pads SPD. The sensing lines SL1, SL2, andSL3 may electrically connect the sensing electrodes SE1 and SE2 to thesensing pads SPD.

In FIGS. 5A and 5B, the second sensing line SL2, which is connected tothe sensing pad SPD, will be illustrated, as an example. The secondsensing line SL2 may be disposed on the encapsulation substrate 210-U.In an embodiment, an insulating layer may be disposed between the secondsensing line SL2 and the encapsulation substrate 210-U. The firstinsulating layer 221 may be disposed on the second sensing line SL2, andthe second insulating layer 222 may be disposed on the first insulatinglayer 221.

In an embodiment, the second sensing line SL2 may be formed by the sameprocess as that for the first and third portions B1 and B3 of the bridgepattern BP2 and a first pad MP, and may include a same material as thefirst and third portions B1 and B3 and the first pad MP.

In an embodiment, the second sensing line SL2 and the sensing pad SPDmay be provided as a single object. In an embodiment, unlike thestructure shown in FIGS. 5A to 6, the second sensing line SL2 may have asame width as that of the sensing pad SPD.

As shown in FIG. 6, the input sensor 220 may include the sensing padSPD. FIG. 6 illustrates, as an example, the second sensing line SL2 andthe sensing pad SPD, which are disposed in the second pad region PDA2(in particular, in the region AR3 of FIG. 3) and are connected to eachother, but the inventive concept is not limited to this example. Thesensing pad SPD may include a first pad MP and a second pad TP. Thesecond pad TP may be disposed on the first pad MP. The second pad TP maybe disposed on the first insulating layer 221 and may be connected tothe first pad MP through a first contact hole CNT penetrating the firstinsulating layer 221. In an embodiment, the first pad MP may be formedof or include at least one of metallic materials. For example, the firstpad MP may be formed of or include at least one of titanium (Ti),aluminum (Al), copper (Cu), gold (Au), or silver (Ag).

In an embodiment, the second pad TP may be formed by the same process asthat for the first sensing electrode SE1, the electrode patterns SP2,and the second portion B2 and may be formed of or include a samematerial as the first sensing electrode SE1, the electrode patterns SP2,and the second portion B2. In an embodiment, the second pad TP may beformed of or include at least one of transparent conductive oxide (TCO)materials. In an embodiment, the second pad TP may be formed of orinclude at least one of indium tin oxide (ITO), indium zinc oxide (IZO),zinc oxide (ZnO), or indium tin zinc oxide (ITZO), and, in anembodiment, the second pad TP may be formed of or include PEDOT, metalnano wires, or graphene.

The sensing pad SPD may include a pad portion PP and an edge portion EP.The pad portion PP may be a portion electrically connected to theflexible circuit board CF, and the edge portion EP may correspond to aportion, which is extended from the pad portion PP to an edge EZ of theinput sensor 220 (or the encapsulation substrate 210-U).

The pad portion PP may include a first pad MP1 and a second pad TP1,which are electrically connected to pads of the flexible circuit boardCF through an anisotropic conductive film, solder balls, or the like.For example, the first pad MP1 of the pad portion PP may be connected tothe sensing electrode through the second sensing line SL2 and may beelectrically connected to the second pad TP1 of the pad portion PPthrough the first contact hole CNT. In an embodiment, a plurality of thefirst contact holes CNT may be provided. The second pad TP1 of the padportion PP, along with the first pad MP1, may be electrically coupled tothe pad of the flexible circuit board CF, through an anisotropicconductive film, a solder ball, or the like, in contact therewith.

The edge portion EP may include a first pad MP2 and a second pad TP2,which are extended from the pad portion PP to the edge EZ of the inputsensor 220 (or the encapsulation substrate 210-U). The first pad MP2 ofthe edge portion EP may be extended from the first pad MP1 of the padportion PP, and the second pad TP2 of the edge portion EP may beextended from the second pad TP1 of the pad portion PP. In anembodiment, the first pad MP2 of the edge portion EP and the first padMP1 of the pad portion PP may be provided as a single object, and thesecond pad TP2 of the edge portion EP and the second pad TP1 of the padportion PP may be provided as a single object. FIG. 6 illustrates anexample in which the first and second pads MP2 and TP2 of the edgeportion EP are provided to have widths smaller than the first pad MP1and the second pad TP1 of the pad portion PP, but the inventive conceptis not limited to this example. For example, the pads of the edgeportion EP and the pad portion PP may be provided to have the samewidth.

In the pad portion PP, the second pad TP1 may be disposed on the firstpad MP1, and the first pad MP1 may be covered with the second pad TP1.In the pad portion PP, the first pad MP1 may be overlapped with thesecond pad TP1.

In the edge portion EP, the second pad TP2 and the first pad MP1 may bespaced apart from each other when viewed in a plan view. In the edgeportion EP, at least a portion of the second pad TP2 may be overlappedwith the first pad MP2, and the remaining portion may not be overlappedwith the first pad MP2. In other words, the second pad TP2 of the edgeportion EP may be extended from the second pad TP1 of the pad portion PPand may include at least a portion, which is disposed in a detouringmanner that it is not overlapped with the first pad MP2 of the edgeportion EP. For example, the second pad TP2 of the edge portion EP mayinclude first to third extension portions, which are sequentiallyconnected to each other. The first extension portion may be extendedfrom the pad portion PP in the second direction DR2 to be overlappedwith a portion of the first pad MP2. The second extension portion may beextended in the first direction DR1 such that it is not overlapped withthe first pad MP2 of the edge portion EP in a thickness direction, andthe third extension portion may be extended to the edge EZ of the inputsensor 220 in the second direction DR2, when viewed in a plan view,while maintaining a distance from the first pad MP2.

In an embodiment, the edge portion EP may include a first region A1 anda second region A2. The first region A1 may be adjacent to the padportion PP, and the second region A2 may be adjacent to the edge EZ ofthe input sensor 220. The second region A2 may correspond to a regionwhich is extended from the first region A1 to the edge EZ of the inputsensor 220. The edge portion EP may include a first portion P1 and asecond portion P2. The first portion P1 may be disposed in the firstregion A1, and the second portion P2 may be disposed in the secondregion A2. The first portion P1 may include the first pad MP2, thesecond pad TP2, the first insulating layer 221, and the secondinsulating layer 222, which are disposed on the encapsulation substrate210-U. The second portion P2 may include the second pad TP2 disposed onthe encapsulation substrate 210-U. In another embodiment, the secondportion P2 may include the second pad TP2 and the second insulatinglayer 222 on the second pad TP2.

In an embodiment, an end of the second portion P2 may be aligned to theedge EZ of the input sensor 220 in a thickness direction of the inputsensor 220. In further detail, a second pad TP2-1 of the second pad TP2of the edge portion EP constituting the second portion P2 may bedisposed on the encapsulation substrate 210-U and may be exposed to theoutside, and an end of the second pad TP2-1 in the second direction DR2may be aligned to the edge EZ in the thickness direction.

FIG. 7A is a cross-sectional view taken along the line I-I′ of FIG. 6.FIG. 7B is a cross-sectional view taken along the line II-II′ of FIG. 6.FIG. 7C is a cross-sectional view taken along the line III-III′ of FIG.6. FIG. 7D is a cross-sectional view taken along the line IV-IV′ of FIG.6. FIG. 7E is a cross-sectional view taken along the line V-V′ of FIG.6.

Referring to FIG. 7A, the pad portion PP of the sensing pad SPD (e.g.,see FIG. 6) may be disposed over the encapsulation substrate 210-U. Thefirst pad MP1 of the pad portion PP may be directly disposed on theencapsulation substrate 210-U. The first insulating layer 221 may bedisposed on the first pad MP1, and the second pad TP1 may be disposedover the first insulating layer 221. The second insulating layer 222 maybe disposed on the second pad TP1. The first contact hole CNT may bedefined in the first insulating layer 221. The first pad MP1 and thesecond pad TP1 may be electrically connected to each other through thefirst contact hole CNT. A second contact hole SD may be defined in thesecond insulating layer 222. The second contact hole SD may be providedto expose the second pad TP1.

Referring to FIG. 7B, the edge portion EP of the sensing pad SPD (seeFIG. 6) may be disposed on the encapsulation substrate 210-U. In anembodiment, each of the first pad MP2, the second pad TP2, and the firstand second insulating layers 221 and 222 of the edge portion EP may beextended from a corresponding one of the first pad MP1, the second padTP1, and the first and second insulating layers 221 and 222 of the padportion PP to constitute a single object. FIG. 7B illustrates the firstportion P1 of the edge portion EP. As shown in FIG. 7B, a portion of thesecond pad

TP2 may be disposed to be overlapped with the first pad MP2.

Referring to FIG. 7C, in the first region Al of the edge portion EP ofthe sensing pad SPD (see FIG. 6), the second insulating layer 222 maycover all of the first pad MP2, the first insulating layer 221, and thesecond pad TP2. As shown in FIG. 7C, an end of the first insulatinglayer 221 may be substantially aligned to an end of the first pad MP2 ina thickness direction. The end of the first insulating layer 221 and theend of the first pad MP2, which are located near the end of the firstportion P1 adjacent to the second portion P2, may be aligned to eachother.

Referring to FIG. 7D, the first and second pads MP2 and TP2 may bedisposed in the first region Al such that they are not overlapped witheach other. When viewed in a plan view, the first and second pads MP2and TP2 may be disposed to be spaced apart from each other.

Referring to FIG. 7E, the second portion P2 may include the second padTP2-1 in the second region A2. As shown in FIG. 6, the second portion P2of the sensing pad SPD may be configured to substantially include onlythe second pad TP2-1 in the second region A2.

FIGS. 8A to 8D are plan views illustrating a method of fabricating adisplay device, according to an embodiment of the inventive concept.

Referring to FIGS. 8A to 8D, a method of fabricating a display devicemay include providing a display panel, disposing an input sensor on thedisplay panel, and cutting the display panel and the input sensor alonga cutting region CTL. Each of the display panel and the input sensor mayinclude a pad region and the cutting region CTL adjacent to the padregion. The input sensor may include the pad portion PP and the edgeportion EP in the pad region. The edge portion EP may be adjacent to thecutting region CTL. Here, the cutting region CTL may correspond to aregion, which will be cut in a cell process of cutting a mothersubstrate into a plurality of unit cells. This will be described infurther detail with reference to FIGS. 9 and 10.

The disposing of the input sensor may include disposing the first padMP2 on the display panel, disposing the second pad TP2 on the first padMP2, and removing the first pad MP2 of the input sensor, which isoverlapped with the cutting region CTL of the display panel.

The disposing of the second pad TP2 on the first pad MP2 may includedisposing the second pad TP2 such that the first and second pads MP2 andTP2 are not overlapped with each other in the cutting region CTL.Thereafter, the disposing of the input sensor may include removing thefirst pad MP2 overlapped with the cutting region CTL. The first pad MP2may not be overlapped with the second pad TP2 in the cutting region CTLand may be exposed to the outside. In an embodiment, the removing of thefirst pad MP2 in the cutting region CTL may include etching a portion ofthe first pad MP2 overlapped with the cutting region CTL.

In an embodiment, the disposing of the input sensor may further includedisposing the first insulating layer 221 on the first pad MP2 anddisposing the second pad TP2 on the first insulating layer 221. Thefirst insulating layer 221 may be overlapped with a pad region of thefirst pad MP2. The first insulating layer 221 may not be overlapped withthe cutting region CTL. Thus, the first pad MP2 may be exposed to theoutside in the cutting region CTL and may be covered with the firstinsulating layer 221 in the pad region. During the etching of theportion of the first pad MP2 overlapped with the cutting region CTL, thefirst insulating layer 221 may cover a portion of the first pad MP2,which is different from the portion to be removed. In other words, thefirst insulating layer 221 may serve as a mask for etching the cuttingregion CTL or the first pad MP2 therein.

If the first pad MP2 is removed, only the second pad TP2, which isspaced apart from or non-overlapped with the removed first pad MP2, maybe disposed in the cutting region CTL. The second pad TP2 may be cutwhen the input sensor is cut along the cutting region CTL. The cuttingportion of the second pad TP2 may be exposed to the outside.

In an embodiment, the fabricating method may further include disposingthe second insulating layer 222, which is overlapped with the cuttingregion CTL, but not with the pad region, and covers the first and secondpads MP2 and TP2, and, here, the disposing of the second insulatinglayer 222 may be performed after the removing of the portion of thefirst pad MP2 overlapped with the cutting region CTL and before thecutting of the cutting region CTL of the input sensor. In anotherembodiment, the second insulating layer 222 may be overlapped with thecutting region CTL.

As shown in FIG. 8A, the first and second pads MP2 and TP2 of the edgeportion EP may include portions which are at least partially spacedapart from each other and are not overlapped with each other in thethickness direction when viewed in a plan view. The first insulatinglayer 221 may cover the edge portion EP of the first pad MP2. FIG. 8Aillustrates a mother substrate (e.g., including adjacent unit cellsconnected to each other by the first and second pads MP2 and TP2) beforethe cell process. The first pad MP2 of the display device may beextended to a first pad MP2-2 of a neighboring unit cell, and the secondpad TP2 may be bent to avoid an overlapping with the first pad MP2 andto be connected to a second pad TP2-2 of the neighboring unit cell. Thesecond pads TP2 and TP2-2 may be connected to the first pads MP2 andMP2-2, respectively, through first contact holes CNT and CNT-2.

FIG. 8B illustrates a structure formed by removing the portion of thefirst pad MP2, which is not covered with the first insulating layer 221,by the etching process. In an embodiment, although the first pad MP2 isdisconnected from the first pad MP2-2 of the neighboring unit cell, thesecond pads TP2 and TP2-2 may be connected to each other and the padportion PP may be electrically connected to the pad portion of theneighboring unit cell through the first contact holes CNT and CNT-2.That is, the second pads TP2 and TP2-2 may be connected to each other,thereby functioning as a shorting bar.

FIGS. 8C and 8D illustrate steps of disposing the second insulatinglayer 222 and cutting the cutting region CTL. The edge EZ of the inputsensor may be formed by cutting the cutting region CTL. An end of thesecond pad TP2 aligned to the edge EZ may be exposed to the outside.Since the second pad TP2 is exposed to the outside in the edge EZ andthe first pad MP2 was previously removed, the second pad TP2 may not beoverlapped with the first pad MP2 near the edge EZ or in the cuttingregion CTL. Thus, in the input sensor according to an embodiment of theinventive concept, it may be possible to prevent or substantiallyprevent a corrosion issue, which is caused by the overlapping andexposing of the first and second pads MP2 and TP2, in the cutting regionCTL and thereby to reduce a failure rate of the display device.

FIG. 9 is a plan view illustrating a method of fabricating a displaydevice, according to an embodiment of the inventive concept. FIG. 10 isa plan view illustrating a method of fabricating a display device,according to an embodiment of the inventive concept.

Referring to FIG. 9, a mother substrate WP may correspond to a workingpanel, which will be cut into a plurality of unit cells. The displaydevice according to an embodiment of the inventive concept may be formedin each unit cell. A cutting wheel CHW may be used to cut the mothersubstrate WP into the unit cells. Here, the mother substrate WP may beformed by combining a first working substrate WS1 with a second workingsubstrate WS2. One of the first and second working substrates WS1 andWS2 may be an encapsulation substrate, on which an input sensor isprovided, and the other may correspond to a display substrate, in whichpixels or the like are provided. A region A4 of FIG. 9 may include padand cutting regions of a substrate in each unit cell.

FIG. 10 illustrates the pad and cutting regions in each unit cell of themother substrate WP. Referring to FIG. 10, the cutting region CTL may bedefined in a dummy portion DMP provided with dummy pads, which areextended from the pad portion PP and are connected to a neighboring unitcell. The dummy portion DMP may include an edge portion 12, which isextended from each pad of the pad portion PP and is overlapped with thecutting region CTL, a connecting portion 13, which connects the edgeportions 12 of the pads to each other, and a shorting bar 14, whichconnects the connecting portions 13 of the unit cells to each other. Thedummy portion DMP according to an embodiment of the inventive conceptmay include the second pad TP2 (see FIG. 6) provided on theencapsulation substrate. The second pad TP2 may function as a shortingbar, which connects the unit cells to each other through a contact hole.The shorting bar 14 may include the second pad TP2 (see FIG. 6). Theunit cells may be connected to each other by the shorting bar 14, untila cell process is performed, and, thus, the display device may beprevented or substantially prevented from failing by an electrostaticdischarging issue.

FIGS. 11A and 11B are plan views, each of which illustrates a pad regionof a display device according to an embodiment of the inventive concept.

As shown in FIG. 11A, the first and second pads MP2 and TP2 of the edgeportion EP may be extended from the pad portion PP and may be spacedapart from each other. For example, the first and second pads MP2 andTP2 of the edge portion EP may be disposed such that they are not fullyoverlapped with each other.

As shown in FIG. 11B, a plurality of the second pads TP2 may be extendedfrom the second pad TP1 of the pad portion PP. Although FIG. 11Billustrates an example in which two second pads TP1 are provided, theinventive concept is not limited to this example. In an embodiment, allof the second pads TP2 of the edge portion EP may not be overlapped withthe first pad MP2.

As shown in FIGS. 11A and 11B, in the second region A2 of the edgeportion

EP, at least one of the second pads TP2-1 may be aligned to the edge EZ.The first pad MP2 of the first region Al may be aligned to the firstinsulating layer 221.

According to embodiments of the inventive concept, a failure rate in aninput sensor may be reduced. For example, a display device may beconfigured to prevent or substantially prevent corrosion from occurringin a pad region of the input sensor.

In addition, a corrosion-induced failure may be prevented orsubstantially prevented from occurring in the input sensor, during aprocess of fabricating a display device.

While some example embodiments of the inventive concept have beenparticularly shown and described, it will be understood by one ofordinary skill in the art that variations in form and detail may be madetherein without departing from the spirit and scope of the inventiveconcept, as set forth in the attached claims.

What is claimed is:
 1. A method of fabricating a display device, themethod comprising: providing a display panel, in which a display region,a pad region, and a cutting region are defined, the pad region and thecutting region being adjacent to the display region; arranging an inputsensor comprising a sensing pad, on the display panel; and cutting thedisplay panel and the input sensor along the cutting region, wherein thearranging the input sensor comprises: arranging a first pad, which is atleast overlapped with the pad region and the cutting region, on thedisplay panel; arranging a second pad on the first pad; and removing aportion of the first pad overlapped with the cutting region, wherein thearranging the second pad is performed such that the second pad is notoverlapped with the first pad in the cutting region.
 2. The method ofclaim 1, further comprising arranging an insulating layer, which is notoverlapped with the cutting region and covers the first pad and thesecond pad, wherein the arranging the insulating layer is performedbetween the removing the portion of the first pad overlapped with thecutting region and the cutting the display panel along the cuttingregion.
 3. The method of claim 1, wherein the removing the portion ofthe first pad overlapped with the cutting region comprises etching aportion of the first pad overlapped with the cutting region.
 4. Themethod of claim 1, wherein the arranging the input sensor furthercomprises: arranging a first insulating layer on the first pad; andarranging a second pad on the first insulating layer.
 5. The method ofclaim 4, wherein the first insulating layer is not overlapped with thecutting region, and the insulating layer covers a portion of the firstpad, which is different from the portion to be removed, when a portionof the first pad overlapped with the cutting region is etched.
 6. Themethod of claim 1, wherein the input sensor comprises a pad portion andan edge portion, which are overlapped with the pad region, and the edgeportion is adjacent to the cutting region.
 7. The method of claim 6,wherein the arranging the second pad is performed such that, in the edgeportion, at least a portion of the second pad is not overlapped with thefirst pad.